Discussion specific to the DIP and TQFP packaged ZX devices like the ZX-40, ZX-44, ZX-32 and ZX-328 series. The differences between these devices is primarily the packaging and pinout so most issues will apply to all devices.
I'm thinking about using the TQFP package in a board. I've used ExpressPCB to build boards for BasicX-01 (40-pin dip), but like the TQFP package. The Atmel spec for the ATmega32 specifies "Bottom pad should be soldered to ground" on the Pin Configuration sheet. Has anyone used the TQFP package? If so did you solder the bottom pad?
Thanks.. Jay
The TQFP package has no bottom pad. The MLF package does, however. The ZX-24 uses the TQFP package and it has traces below the chip. You can't do that with an MLF package because of the bottom pad.
Don, thanks. The spec sheet from Atmel is confusing .. the note specifies package for TQFP/MLF but doesn't differentiate between the TQFP and MLF. I dont' know the difference.
thanks again, Jay
jay wrote:Don, thanks. The spec sheet from Atmel is confusing .. the note specifies package for TQFP/MLF but doesn't differentiate between the TQFP and MLF. I dont' know the difference.
thanks again, Jay
Look at Packaging Information starting on p331 of the datasheet. MLF pretty much requires a reflow (cum toaster) oven.