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ZX44 TQFP ATmega32
Posted: 08 July 2006, 14:06 PM
by jay
I'm thinking about using the TQFP package in a board. I've used ExpressPCB to build boards for BasicX-01 (40-pin dip), but like the TQFP package. The Atmel spec for the ATmega32 specifies "Bottom pad should be soldered to ground" on the Pin Configuration sheet. Has anyone used the TQFP package? If so did you solder the bottom pad?
Thanks.. Jay
Posted: 08 July 2006, 14:58 PM
by dkinzer
The TQFP package has no bottom pad. The MLF package does, however. The ZX-24 uses the TQFP package and it has traces below the chip. You can't do that with an MLF package because of the bottom pad.
Posted: 08 July 2006, 16:46 PM
by jay
Don, thanks. The spec sheet from Atmel is confusing .. the note specifies package for TQFP/MLF but doesn't differentiate between the TQFP and MLF. I dont' know the difference.
thanks again, Jay
Posted: 08 July 2006, 17:09 PM
by DH*
jay wrote:Don, thanks. The spec sheet from Atmel is confusing .. the note specifies package for TQFP/MLF but doesn't differentiate between the TQFP and MLF. I dont' know the difference.
thanks again, Jay
Look at
Packaging Information starting on p331 of the datasheet. MLF pretty much requires a reflow (cum toaster) oven.